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Impact-Activated Ink Release for Advanced Inkjet Printing using Liquid Crystal Substrates

Engineering & Physical Sciences
Electronics & Photonics
Instrumentation
Materials/Chemicals
Composites
College
College of Engineering (COE)
Researchers
Wang, Xiaoguang "William"
Zhang, Meng
Licensing Manager
Randhawa, Davinder
614-247-7709
randhawa.40@osu.edu

T2025-255

The Need

Current inkjet printing technologies are limited by the need for inks with specific viscosity and ejection properties, which restricts the range of printable materials and compromises print resolution due to droplet splashing. There is a significant need for a printing method that enables precise deposition of a broader spectrum of functional materials, including those that are conventionally hard to print, without sacrificing throughput or resolution.

The Technology

This technology, developed by Ohio State engineers, utilizes a liquid crystal (LC) receiving substrate that encapsulates ink or functional chemicals. Upon impact by a droplet, the substrate releases the encapsulated ink to the surface, enabling printing that is independent of ink viscosity or ejection speed. The LC substrate responds selectively to droplet impact, allowing controlled release only above a threshold velocity, thus expanding the capabilities of inkjet printing to new material classes.

Potential Commercial Applications

  • Additive manufacturing of thermosetting and semiconducting polymers
  • Fabrication of free-standing organic electronics for sensors and wearables
  • High-resolution printing of functional materials for healthcare and environmental devices
  • Advanced inkjet and liquid-liquid printing for specialty coatings

Benefits/Advantages

  • Enables printing of materials previously inaccessible to inkjet methods
  • Decouples printability from ink viscosity and ejection speed constraints
  • Reduces splashing and improves print resolution
  • Facilitates easy removal of printed products due to the fluid nature of the LC substrate
  • Offers tunable release and spatial patterning for customized manufacturing